PROBLEM TO BE SOLVED: To provide an improved manufacturing method for forming and assembling inexpensive RFID tags. SOLUTION: A method of manufacturing RFID inlay structures includes providing a strap substrate containing an RFID chip. Strap pad patterns are formed adjacently to recessed regions over contact parts of the RFID chip using a directly electroplateable resin (DER). The strap substrate is attached to an inlay substrate having an electrically conductive antenna and antenna contact part patterns. The DER strap pad patterns, antenna pattern, antenna contact parts and chip contact parts are electroplated, thereby forming a metal interconnect part between the contact parts of the RFID chip and the antenna contact parts on the inlay substrate. The strap substrate may be obtained from a web of strap substrates formed by a casting process. COPYRIGHT: (C)2007,JPO&INPIT