Invention Patent
- Patent Title: Method of manufacturing wiring substrate
- Patent Title (中): 制造接线基板的方法
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Application No.: JP2006065986Application Date: 2006-03-10
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Publication No.: JP2007243032APublication Date: 2007-09-20
- Inventor: FURUHATA HIDEMICHI , KIMURA SATOSHI , KANEDA TOSHIHIKO , KIJIMA TAKESHI
- Applicant: Seiko Epson Corp , セイコーエプソン株式会社
- Assignee: Seiko Epson Corp,セイコーエプソン株式会社
- Current Assignee: Seiko Epson Corp,セイコーエプソン株式会社
- Priority: JP2006065986 2006-03-10
- Main IPC: H05K3/18
- IPC: H05K3/18
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring substrate by which high-density wiring can be formed with high accuracy without using a plated resist.
SOLUTION: The method is used to manufacture a wiring substrate by a nonelectrolytic plating method which can precipitate metal without using the plated resist, and it includes a step (a) to form a catalyst layer in a specified pattern on a substrate, a step (b) to form a first metal layer by immersing the substrate in a nonelectrolytic plating liquid to precipitate metal on the catalyst layer, a step (c) to expose the upper surface of the substrate in steam, and a step (d) to form a second metal layer by immersing the substrate in the nonelectrolytic plating liquid to further precipitate metal on the first metal layer.
COPYRIGHT: (C)2007,JPO&INPIT
SOLUTION: The method is used to manufacture a wiring substrate by a nonelectrolytic plating method which can precipitate metal without using the plated resist, and it includes a step (a) to form a catalyst layer in a specified pattern on a substrate, a step (b) to form a first metal layer by immersing the substrate in a nonelectrolytic plating liquid to precipitate metal on the catalyst layer, a step (c) to expose the upper surface of the substrate in steam, and a step (d) to form a second metal layer by immersing the substrate in the nonelectrolytic plating liquid to further precipitate metal on the first metal layer.
COPYRIGHT: (C)2007,JPO&INPIT
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