Invention Patent
- Patent Title: Mems device and its assembly method
- Patent Title (中): MEMS器件及其组装方法
-
Application No.: JP2007236247Application Date: 2007-09-12
-
Publication No.: JP2008068396APublication Date: 2008-03-27
- Inventor: BEX JAN , KNAAPEN RAYMOND JACOBUS , NIJSSE GERARD JOHANNES PIETER , KUMS GERARD
- Applicant: Asml Netherlands Bv , エーエスエムエル ネザーランズ ビー.ブイ.
- Assignee: Asml Netherlands Bv,エーエスエムエル ネザーランズ ビー.ブイ.
- Current Assignee: Asml Netherlands Bv,エーエスエムエル ネザーランズ ビー．ブイ．
- Priority: US51920406 2006-09-12
- Main IPC: B81C3/00
- IPC: B81C3/00 ; B81B1/00
Abstract:
PROBLEM TO BE SOLVED: To improve flatness of a MEMS device so that mating faces of the MEMS device and substrate are joined by using an adhesive. SOLUTION: A method for gluing the MEMS device to the substrate in order to form a MEMS device assembly comprises the steps of: measuring at least one of a thickness profile S100a of the MEMS device and flatness S100b of the mating face of the substrate; S110 applying the adhesive on at least one of the mating face of the MEMS device and mating face of the substrate; and S120 joining the mating faces of the MEMS device and substrate so that the adhesive makes the MEMS device and substrate glue. An amount of the adhesive applied on one of two mating faces or both mating faces is selected so as to compensate the thickness profile of the MEMS device and the locally fluctuated flatness of the mating face of the substrate. COPYRIGHT: (C)2008,JPO&INPIT
Information query
