PROBLEM TO BE SOLVED: To obtain a semiconductor chip package provided with a tape wiring circuit board for dealing with a semiconductor chip having many pads.
SOLUTION: A second output wire 16 and a third output wire 18 are extended into a chip mounting part 26 crossing a second side 26A and a third side 26D of the chip mounting part 26. The other end portions of the second output wire 16 and the third output wire 18 extended into the chip mounting part 26 are bent toward a fourth side 26B of the chip mounting part 26 and are connected to output pads 42 and 44 provided along the fourth side of a semiconductor chip 22. An input wire 20 is extended along the fourth side 26B of the chip mounting part 26, bent in the halfway thereof and extended into the chip mounting part 26 crossing the fourth side 26B of the chip mounting part 26, and is connected to an input pad 48 provided along the fourth side of the semiconductor chip 22. Accordingly, the tape wiring circuit board 24 can be provided corresponding to the semiconductor chip having many electrode pads.
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