Invention Patent
- Patent Title: Heat-conductive self-adhesive sheet
- Patent Title (中): 导热自粘片
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Application No.: JP2010115604Application Date: 2010-05-19
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Publication No.: JP2011241329APublication Date: 2011-12-01
- Inventor: NAKAYAMA JUNICHI , TSUKAKOSHI TATSUYA , TERADA YOSHIO , SHOJI AKIRA , FURUTA KENJI , TOJO MIDORI
- Applicant: Nitto Denko Corp , 日東電工株式会社
- Assignee: Nitto Denko Corp,日東電工株式会社
- Current Assignee: Nitto Denko Corp,日東電工株式会社
- Priority: JP2010115604 2010-05-19
- Main IPC: C09J7/00
- IPC: C09J7/00 ; C09J11/00 ; C09J133/00
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-conductive self-adhesive sheet which can easily adhere a heat-generating member to a heat-releasing member and is excellent in heat conductivity.SOLUTION: The heat-conductive self-adhesive sheet having an adhesive layer prepared by forming a heat-conductive adhesive composition containing a heat-conductive substance and an acrylic polymer component into a sheet-like shape is characterized in that the complex modulus of elasticity of the self-adhesive layer at 100°C is 1.0×10to 1.0×10Pa.
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