PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, excellent in productivity, capable of improving stability of mechanical connection between a semiconductor substrate and a wiring board, and capable of improving stability of electrical connection between an electrode of the semiconductor substrate and wiring of the wiring board.SOLUTION: The semiconductor device comprises: a first insulation adhesive disposed between a surface area of a semiconductor substrate between electrodes of different polarities and a surface area of an insulation base material between neighboring wiring; and a second insulation adhesive disposed between the first insulation adhesive and a conductive adhesive. In the manufacturing method to manufacture the semiconductor device, a first insulation adhesive has a property to become a second cured state after becoming a softening state after becoming a first cured state and viscosity of the first insulation adhesive is kept higher than that of the second insulation adhesive until the first insulation adhesive becomes the second cured state.