它包括浮雕路径的压力，减少短路的邻近焊接球，提供了一种改进的形状的激光封装（MLP）封装的风险。 MLP封装可以具有一个或通过经由一体地连接到凹槽多个模具，设置在通过通孔的模具，同时还减少了相邻焊球间的焊料短路的风险，在制造过程 湿气使得能够减少经由在通过进入模具时产生的压力的路径。 此外，MLP封装包括通过一体地连接到沟槽，从而允许更紧密的凸块间距和更薄的组件通过一个或多个模具。 其结果，能够改善与表面相关联的过程的裕度和风险贴装技术（SMT），在库存管理相灵活性增加。

Includes a reduction path for the pressure, to reduce the risk of short-circuiting the adjacent solder balls, improved molding laser package (MLP) package is provided. MLP package may have one or more of the mold through via a groove which is integrally connected to the located in the mold through the via, while also reducing the risk of solder shorts between adjacent solder balls, the manufacturing process moisture makes it possible to reduce the route the pressure that is generated when entering into the mold through vias in. In addition, the MLP packages including one or more of the mold through via a groove which is integrally connected to the, allowing closer bump pitch and thinner packages. As a result, it is possible to improve the margin and risk of the process associated with surface mount technology (SMT), flexibility in inventory management phase is increased.