Semiconductor module (10) includes a substrate plate (14), and a semiconductor switch chip attached to the collector conductor of the substrate plate (14) (16) (22a) and diode chips (24a). Diode chip (24a) is electrically connected to the semiconductor switch chip (22a) to Hantaira column. The semiconductor switch chip (22a) is electrically connected to the emitter conductor on a substrate plate (14) (18) through a bond wire (28), brings the first emitter current path (50a), the emitter conductor (18) is arranged on the opposite side of the semiconductor switch chip (22a) with respect to the diode chip (24a). The gate electrode of the semiconductor switch chip (22a) (40a) is electrically connected to a gate conductor (20) on the substrate plate (14) via the bond wires (28), resulted in a gate current path (54a) , the gate conductor (18) is arranged on the opposite side of the semiconductor switch chip (22a) with respect to the diode chip (24a). In near the emitter conductors (18) projecting region (44) of the diode chip (24a) extending toward the first semiconductor switch chip (22a), the first semiconductor switch chip (22a) is bond wires ( 28) is directly connected to the protruding region (44) through the leads to the gate current path (additional emitter current path along 54a) extending at least partially (52). The semiconductor switch chip (22a) is a first semiconductor switch chip, a diode chip (24a) is a first diode chips, which are arranged in a first row (42a). Semiconductor module (10) further includes a second semiconductor switch chip (22b) and the second diode chip (24a, 24b) attached to the collector conductor (16) and a second row of (42b). Each column of the diode chip (24a, 24b) includes a semiconductor switch chip (22a, 22b) of the same column as are electrically connected to Hantaira column, first row and second rows (42a, 42b ) is electrically connected in parallel. The first semiconductor switch chip (22a) is disposed beside the second diode chip (24b), a second semiconductor chip (22b) is disposed beside the first diode chip (24a).