Electronic module and fabrication method thereof comprises a cover electronic component disposed on the cover substrate is disposed on the base substrate base electronic component and the free-form free-standing interconnect pillars for electrically connecting. Freeform self interconnect pillar may extend longitudinally within the linear path between the cover electronic parts and base electronic component. Freeform self interconnect pillar may be formed of a conductive filament which is provided by the additive manufacturing process. By freeform the direct autonomous interconnect pillar on the electronic component, while reducing the complexity and cost for manufacturing such an electronic module, may enhance the flexibility of the electronic module design.