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Invention Patent
JP2021197512A 電子制御装置 审中-公开

電子制御装置
Abstract:
【課題】装置の小型化を保ちつつ電子部品の放熱性を向上した電子制御装置を提供する。 【解決手段】電子制御装置において、第一の回路基板7および第二の回路基板8は、電子部品9が実装された実装面をそれぞれ有する。ベース部材1と電子部品9の間には、熱伝導材10が配置される。ベース部材1は、第一の回路基板7および第二の回路基板8の実装面に垂直な視線方向から見たときに、少なくとも第二の回路基板8とは重ならない第一領域Aと、第一の回路基板7と第二の回路基板8の両方に重なる第二領域Bとを有する。ベース部材1の第一領域Aには、複数の放熱フィン4a,4bからなる放熱部4が設けられ、ベース部材1の第二領域Bには、放熱部4と外部との間を貫通する通風孔11が設けられる。 【選択図】図3
Abstract(English):

To provide an electronic control device in which the heat dissipation of electronic components is improved while downsizing the device.SOLUTION: In an electronic control device, and a first circuit board 7 and a second circuit board 8 respectively have mounting surfaces on which electronic components 9 are mounted. A heat conduction material 10 is disposed between a base member 1 and the electronic component 9. The base member 1 has a first area A that does not overlap on at least the second circuit board 8, and a second area B that overlaps on both of the first circuit board 7 and the second circuit board 8, when viewed from a sight line direction vertical to the mounting surfaces of the first circuit board 7 and the second circuit board 8. In the first area A of the base member 1, a heat radiating portion 4 composed of a plurality of heat radiation fins 4a and 4b is provided, and in the second area B of the base member 1, a ventilation hole 11 penetrating a space between the heat radiating portion 4 and the outside is provided.SELECTED DRAWING: Figure 3

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