Invention Patent
- Patent Title: Electronic component mounting board and a method of manufacturing the same
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Application No.: JP2702197Application Date: 1997-02-10
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Publication No.: JP3450626B2Publication Date: 2003-09-29
- Inventor: 英志 松原
- Applicant: 日本特殊陶業株式会社
- Assignee: 日本特殊陶業株式会社
- Current Assignee: 日本特殊陶業株式会社
- Priority: JP2702197 1997-02-10
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/60 ; H05K3/24
Public/Granted literature
- JPH10223797A ELECTRONIC PART MOUNTING BOARD AND MANUFACTURE THEREOF Public/Granted day:1998-08-21
Information query
IPC分类:
