Invention Patent
- Patent Title: Soldering flux and solder paste composition
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Application No.: JP2006239288Application Date: 2006-09-04
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Publication No.: JP4819624B2Publication Date: 2011-11-24
- Inventor: 真之 千葉 , 昌大 渡部 , 正巳 相原
- Applicant: ハリマ化成株式会社
- Assignee: ハリマ化成株式会社
- Current Assignee: ハリマ化成株式会社
- Priority: JP2006239288 2006-09-04
- Main IPC: B23K35/363
- IPC: B23K35/363 ; B23K35/22 ; H05K3/34
Public/Granted literature
- JP2008062242A Flux for soldering, and solder paste composite Public/Granted day:2008-03-21
Information query
IPC分类:
