Invention Patent
- Patent Title: Wiring conductor and a method for manufacturing the same, and the terminal connecting portion and Pb-free solder alloy
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Application No.: JP2006191579Application Date: 2006-07-12
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Publication No.: JP4904953B2Publication Date: 2012-03-28
- Inventor: 真人 伊藤 , 威 宇佐美 , 寛 山野辺 , 寛 沖川 , 甫 西 , 隆之 辻 , 正義 青山
- Applicant: 日立電線株式会社
- Assignee: 日立電線株式会社
- Current Assignee: 日立電線株式会社
- Priority: JP2006105452 2006-04-06; JP2006191579 2006-07-12
- Main IPC: H01B5/02
- IPC: H01B5/02 ; B23K35/26 ; C22C13/00 ; H01B13/00 ; H01R13/03
Abstract:
A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
Public/Granted literature
- JP2007299722A Wiring conductor, its manufacturing method, terminal connection part, and pb-free solder alloy Public/Granted day:2007-11-15
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