Invention Patent
- Patent Title: Adhesion structure as well as its manufacturing method and apparatus
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Application No.: JP2009020768Application Date: 2009-01-30
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Publication No.: JP5218108B2Publication Date: 2013-06-26
- Inventor: 治 伊奈 , 泰志 岡本 , 孝司 青木
- Applicant: 株式会社デンソー
- Assignee: 株式会社デンソー
- Current Assignee: 株式会社デンソー
- Priority: JP2009020768 2009-01-30
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/38 ; C09J11/04 ; C09J163/00 ; C09J163/02
Public/Granted literature
- JP2010173265A Adhesive structure and method for manufacturing the same and manufacturing apparatus Public/Granted day:2010-08-12
Information query
