Invention Patent
- Patent Title: Thermally conductive silicone rubber composite sheet
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Application No.: JP2010207792Application Date: 2010-09-16
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Publication No.: JP5574532B2Publication Date: 2014-08-20
- Inventor: 晃洋 遠藤 , 貴宏 丸山
- Applicant: 信越化学工業株式会社
- Assignee: 信越化学工業株式会社
- Current Assignee: 信越化学工業株式会社
- Priority: JP2009234273 2009-10-08
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B32B27/18 ; H01B17/60

Abstract:
This invention discloses a thermal conductive silicone rubber composite sheet, comprising of an intermediate layer (A), which is an electric insulating heat resistant film, and cured material layers as an outer layers (B) prepared on both surfaces of said intermediate layer (A), characterized in that said cured material layers (B) are prepared by curing a silicone composition in a thin film state which are formed by coating said silicone composition comprising the following components (a)-(f) on both surfaces of said intermediate layer (A) ; (a) organopolyciloxane having two or more alkenyl groups bonding to a silicon atom within a molecule: 100 mass parts (b) thermal conductive filler: 100-4,000 mass parts (c) organohydrogenpolysiloxane having two or more hydrogen atoms bonding to a silicon atom within a molecule: the amount wherein the mole ratio of [the hydrogen atom bonding to a silicone atom of the present component/an alkenyl group in the component (a)] is 0.5-5.0 (d) platinum group metallic catalyst: effective amount (e) reaction control agent: effective amount, and (f) silicone resin: 50-500 mass parts wherein, the outer layers provided on both surfaces of the intermediate layer (A) may be identical or different.
Public/Granted literature
- JP2011098566A Thermal conductive silicone rubber composite sheet Public/Granted day:2011-05-19
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