The present invention provides: a resin composition which has good solubility and photocurability, while additionally having good alkali developability in cases where a photopolymerization initiator and a compound having one or more carboxyl groups are contained therein, and which enables the achievement of a resin sheet that is suppressed in tack properties; a resin sheet which uses this resin composition; a multilayer printed wiring board; and a semiconductor device. A resin composition according to the present invention contains a specific bismaleimide compound (A) and at least two kinds of maleimide compounds (B) that are different from the bismaleimide compound (A), while being selected from the group consisting of six kinds of specific compounds.