A semiconductor package having a substrate and for this, a semiconductor package is disclosed. A semiconductor package isolation of the block shape arranged on the first through-electrode, the first surface to penetrate the substrate, the first surface and the second surface having a second surface facing the first surface side and the first arranged in the member and the insulating member and the connecting member having the connection in a first through-electrode and electrically the first conductive portion and electrically connected with the first conductive portion connected to, and a second conductive exposed from both sides of the insulating member the substrate body, and third and fourth sides, the third side and passing through the fourth surface, and the insulating member that face each other are arranged vertically with respect to the first surface on the first surface of the substrate body comprising the second conductive unit includes a semiconductor chip and electrically connected with the second through-electrode is exposed from the side.