本发明的实施例涉及半导体器件的制造方法及其半导体器件。 本发明的目的是提供一种用于制造半导体器件的方法及其半导体器件，其可以最小化封装级别的设备和设备的投资，并且可以通过使用插入器使用来实现微再分布层的功能 用于连接需要微再分布层的部分的电路板或晶片制造，以及使用扇出凸起技术形成其它正常再分布层。 为此，公开了制造半导体器件的方法，其包括以下步骤：在胶带上布置多个半导体管芯; 用密封剂将半导体管芯封装在粘合带上; 去除所述胶带，以及在所述密封剂和所述半导体管芯的表面上形成第一再分配层; 通过将所述插入件电连接到所述第一再分配层，将所述半导体管芯彼此电连接; 以及将焊球连接到第一再分配层及其半导体器件。

One embodiment of the invention uses an interposer using the wafer fab or the circuit board for the technical problem is connected to the parts that require fine re-distribution layer that relates to a production method and hence the semiconductor device according to the semiconductor device, to address, the rest of the normal re-distribution layer fan-formed using an out bumping technology, is to minimize the equipment and capital investment in the packaging level and provides a method and therefore the semiconductor device according to the function implementation is easy semiconductor device of a fine re-distribution layer .
To this end the present invention is arranged on the adhesive tape comprising a plurality of semiconductor die; Comprising kaepsyulran Trojan encapsulation of a semiconductor die on said adhesive tape; Removing the adhesive tape and forming a redistribution layer on a surface of the first semiconductor die and the kaepsyulran agent; Comprising the steps of connecting the interposer to the first redistribution layer electrically, so that the plurality of semiconductor die is electrically connected with each other; And it discloses a production method and hence the semiconductor device according to a semiconductor device including the step of connecting the solder ball to the first redistribution layer.