本发明包括一种组分A和组分B，组分A和包含二醇或多元醇的一种含异氰酸酯的，和组分B是至少为至少一个，以及一种或至少一个或甚至成分A或B普遍的 一个偶数和含有环氧预聚物，组分A或B普遍和包含用于环氧预聚物的固化剂，其可通过热，至少组分A和B含有普遍激活是发泡剂，其在加热时，热膨胀被激活 用于制备可固化环氧基化合物的双组分预混物。 本发明还组分A和B为20至100℃范围内的温度下彼此混合，和在范围为40℃以下，从20至100℃在模具尺寸稳定的化合物的温度下引入模具中，这是该混合物预固化 基于化合物形成可热膨胀和可固化的环氧基化合物。 本发明还在22℃尺寸稳定，并通过上述方法获得的，并且施加在所述组件所描述的化合物或引入到成分化合物和20至220℃的发泡和在范围内的温度固化，加强的构件和/ 或绝缘方法。

The present invention comprises a component A and component B, component A and contains a diol or polyol one kind of containing isocyanate, and component B is at least one of at least, and component A or at least one of the at least one kind of B containing an epoxy prepolymer, and the component a, or and at least one contains a curing agent for epoxy prepolymers which can be activated by the heat of B, at least one of the components a and B containing a foaming agent that can be activated by heat, thermally expandable and curable epoxy-relates to a two-component premix for the preparation of a base compound. The invention also components A and B from 20 to mix with each other at a temperature of 100 ℃ range, and introducing the mixture in the mold, which was pre-cured at a temperature ranging from 20 to 100 ℃ in a die dimension stable compounds below 40 ℃ a method of manufacturing a substrate compound, thermally expandable and curable epoxy to form a. The invention also dimensionally stable at 22 ℃, and compounds obtained by the above method, and applying the described compounds in the components or introduced into the component and 20 to 220 ℃ foaming and curing at a temperature in the range, components of the reinforcing and / or it relates to an isolated way.