A granule is provided to show high thermal conductivity suitable for use in electric and electronic components and excellent workability in producing a molded resin and to be useful in production of a thermal conductive resin composition for manufacturing a molded article with high thermal conductivity. A granule has a number average particle diameter of 0.5 to 5 mm and comprises fibers which have a number average fiber diameter of 1 to 50 micrometers and are selected from a group consisting of carbon fibers and alumina fibers mainly containing alumina. The granule is obtained by granulating the fibers with stirring. In the granule, the fibers to be granulated have a bulk density of 0.2 to 1 g/cm^3. A highly thermal conductive resin composition comprises the granule and a resin selected from a thermosetting resin and a thermoplastic resin. Particularly, the resin composition comprises 10 to 300 parts by volume of the granule on the basis of 100 parts by volume of the thermosetting resin or the thermoplastic resin.