发明公开
- 专利标题： 기판 처리 장치
- 专利标题（英）： Substrate processing apparatus
- 专利标题（中）： 基板加工设备
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申请号： KR1020110072537申请日： 2011-07-21
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公开(公告)号： KR1020130011399A公开(公告)日： 2013-01-30
- 发明人: 김을태 , 장인배 , 이희국 , 장상돈
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理商 특허법인가산
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01L21/67 ; H01L21/68
摘要：
PURPOSE: A substrate processing apparatus is provided to reduce the installation space for a supporter by using a bellow assembly. CONSTITUTION: A substrate processing apparatus includes a tray(30) and a lifting device(10). The tray moves up and down to load and unload a substrate on a support. The lifting device moves up and down the tray. The lifting device includes a bellow assembly. The bellow assembly moves the tray up and down.
公开/授权文献
- KR101761597B1 기판 처리 장치 公开/授权日：2017-07-26
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