（配置）本发明提供一种镀锡铜合金端子构件，能够减少使用Sn电镀端子构件的端子的匹配中的插入力。 （溶液）在包含Cu合金的材料的表面上形成Sn组表面层，在Sn组合表面层和材料之间形成Cu和Sn合金层，测量Cu和Sn合金层的采集深度（Rvk） 当CuSn合金层通过熔融除去Sn基表面层而暴露于表面时，其表面积大于等于0.2μm，Sn基表面层的平均厚度大于0.2μm且小于0.6μm， 的CuSn合金层露出在Sn基表面层上，在最上面形成厚度大于0.005μm且小于0.05μm的Ni或NiSn合金的Ni基涂层，在CuSn上形成Ni基涂层 合金层从Sn族表面层露出，表面的动态摩擦系数小于等于0.3。

(assignment)
About the terminals using the Sn-plated material of a single general-purpose embedded tin capable of reducing the insertion force at the time of fit-plated copper alloy is only for the purpose of providing the material.
[MEANS FOR SOLVING PROBLEMS]
The Sn-based surface layer is formed on a substrate surface made of a Cu alloy, and the CuSn alloy layer between the Sn-based surface layer and the base material is formed, to dissolve and remove the Sn-based surface layer, CuSn, measured when sikyeoteul saliency the CuSn alloy layer on the surface and the alloy layer five days higher salaries depth (Rvk) is more than 0.2 ㎛, also is the average thickness of the Sn-based surface layer less than 0.2 ㎛ 0.6 ㎛, and a portion of the CuSn alloy layer is exposed to the Sn-based surface layer, 0.005 ㎛ the outermost surface the Ni-based coating film made of Ni or NiSn alloy having a thickness of less than 0.05 ㎛ is formed, the Ni-based coating layer is formed on the CuSn alloy layer that is exposed through the Sn-based surface layer, and the coefficient of dynamic friction of the surface of 0.3 or less .