根据本发明的各种实施例，电子设备包括：形成电子设备的一个表面的第一盖; 形成所述一个表面的相对表面的第二盖; 布置在第一盖和第二盖之间的印刷电路板（PCB），并且包括面对第一盖的第一表面，面向第二盖的第二表面和侧表面; 至少一个电子部件，其布置在靠近所述侧表面的一部分的所述第一表面上; 屏蔽结构，包括设置在所述第一盖和所述第一表面之间以覆盖所述电子部件的盖，以及从所述盖的周边朝向所述第一表面延伸的侧壁; 形成在所述PCB的侧表面的一部分上的第一导电结构; 以及设置在所述PCB的所述第一表面的一部分上的第二导电结构，其连接到所述第一导电结构，并具有指向所述第一盖的表面。 所述侧壁在与所述表面不平行的第一方向上延伸，并且包括与所述表面接触的部分。 当从PCB的第一表面上方观察时，与表面接触的侧壁的部分可以与第二导电结构重叠。

In various embodiments of the present invention to electronic devices, the first cover forming one surface of the electronic device; Second cover which forms the second side of said one surface; The first cover and the second cover is disposed between a printed circuit board including a first surface facing the first cover, the second surface facing the second cover, and side; Adjacent to a portion of the side, at least one electrical component disposed on the first surface; Shield structure including said at least one electronic component so as to cover the first cover and the cover is disposed between said first side, and a side wall extending towards the first side from the edge of the lid; A first conductive structure formed on a part of the side of the PCB; And on a portion of the PCB the first surface of the first being connected to the conductive structure, and a second electrically conductive structure having a surface destined to the first cover, the side wall, the surface and the critical passer first direction as extend in, and includes a portion in contact with the surface, the portion in contact with the surface of the side wall, when viewed from above the first surface of the PCB, may be overlapped with the second conductive structure.