一种制造封装发光器件的新颖方法。 可以在封装LED芯片期间使用的优选的脱模膜具有与所需的模制温度相比足够低的弹性模量和玻璃化转变温度，所述模制温度与脱模膜将紧密地配合到模腔的内部 用于形成围绕LED芯片的保护透镜。 根据本发明实施方案的优选的脱模膜包含全氟化的聚合物，例如全氟烷氧基聚合物，包括MFA或氟化乙烯丙烯。

The new sealing the light emitting device manufacturing method. The LED chip sealing development process preferred release film is sufficiently low elastic modulus and glass transition with a temperature release film mold cavities is tightly matched to the inner form has a protective lens surrounding an LED chip as compared with the target setting temperature that can be used in It is used. The preferred release film of the embodiment according to the present invention comprises an alkoxy polymer, or a fluorinated ethylene propylene-perfluoro, including fully fluorinated polymers, such as MFA.