（A），（B），（C）和（D）的环氧树脂组合物， （A）成分：有机次膦酸金属盐，（B）成分：环氧树脂，（C）成分：andayi酰胺或其衍生物，（d）组分之间模具：具有二甲yureyi图固化促进剂。 （E），其是通过以下测量方法测量的具有100℃或更高的固化开始温度的咪唑基固化促进剂。 测定方法：将100质量份的环氧当量为180〜220的双酚A型环氧树脂和10质量份的咪唑固化促进剂混合并混合以制备样品树脂组合物。 用于树脂组合物中的样品，和通过固化开始温度测量在所得的DSC曲线的拐点以10℃/分钟的加热速率用差示扫描量热计（DSC）所产生的热量，且切线与基线的交点温度。

To component (A), (B) component, (C) and component (D) an epoxy resin composition containing components. Component (A): an organic phosphinic acid metal salt, (B) component: epoxy resin, (C) components: Die between andayi amide or a derivative thereof, (D) component: a curing accelerator having a dimethyl yureyi ceramics. To the epoxy resin composition is cured starting temperature measured by the measuring method further comprises an imidazole-based curing accelerator of the component (E) less than 100 ℃. Measuring method: epoxy equivalent of the imidazole mixture was added 10 mass parts of the curing accelerator benzimidazole 180-220 of bisphenol A type epoxy resin 100 parts by mass of the resin composition to prepare a sample. The sample for the resin composition, and measuring the amount of heat generated by a differential scanning calorimeter (DSC) at a heating rate of 10 ℃ / min, and the tangent line and the intersection point temperature of the base line at the inflection points of the resultant DSC curve by curing initiation temperature.