The present invention relates to a technology for manufacturing an electronic device having a surface-mounted component, and may be used in avionics, communication, lighting technology, and other fields, and may be composed of a power source, a converter, a sensor, and the like. The technical results consist of improved weight and dimensional properties, improved heat dissipation and improved electromagnetic shielding. This electronic module is composed of a printed circuit board having a three-dimensional structure, the surface of which is formed by a flat portion of the printed circuit board, and its edge is formed as a bending line between the end faces of the printed circuit board. Here, the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and the electronic components and assemblies are grouped on the mounting surfaces of at least two sections of the printed circuit board, so that one electronic component and assembly is divided into a different section of the printed circuit board. It is placed in the empty space between the component and the assembly in the section.