An electronic device is disclosed. An electronic device according to various embodiments of the present disclosure includes a housing, an antenna module disposed along an inner wall of the housing, and a heat dissipating member disposed inside the housing, wherein the antenna module includes a first Circuit board, the plurality of layers includes a plurality of conductive layers and a plurality of non-conductive layers, the conductive layers and the non-conductive layers are alternately stacked, at least one integrated circuit mounted on the first circuit board , At least an antenna array formed on any one of the plurality of layers and electrically connected to the at least one integrated circuit, a conductive member extending from any one of the plurality of conductive layers, and the conductive member. It includes a heat transfer member including a non-conductive member that partially surrounds the heat transfer member, and the heat transfer member is connected to the heat dissipation member to transfer heat generated from the antenna module to the heat dissipation member. Other embodiments are possible.