The present invention comprises a reagent selected from (a) a polymer film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) an initiator, particularly a radical initiator, or an activator, and has improved heat resistance and moisture resistance. Characterized by a reactive adhesive film and a reactive two-component adhesive system in the form of a film for bonding various materials such as metal, wood, glass and/or plastic materials.