【课题】借由在封装体内具备电容，而降低噪音对IC造成之影响。又，实现电子机器之小型化、低成本化。【解决手段】包括：IC芯片2、搭载IC芯片2之框架3、在框架3之下侧，从框架3保持一定的间隔配置之导电板3a、将IC芯片2，框架3，以及与导电板3a电气连接之第一外部端子6a以及第二外部端子6b、包覆IC芯片2，框架3，以及导电板3a，封入之封胶树脂8。

The semiconductor device includes IC chip 2, frame 3 on which the IC chip 2 is mounted, conductive plate 3a disposed beneath the frame 3 at given interval from the frame 3, first external terminal 6a and second external terminal 6b that electrically connects the IC chip 2, the frame 3, and the conductive plate 3a, and molding compound 8 covering and encapsulating the IC chip 2, the frame 3, and the conductive plate 3a.