本发明提供可共固化组合物，其包含一种阴离子或阳离子反应性成份，如一种环氧或环硫化物(episulfide)树脂成份；一种自由基可聚合成份；及一种交联成份，其中交联成份各与阴离子或阳离子反应性成份及自由基可聚合成份反应，以至少一个基经由一个阴离子或阳离子机制反应及至少一个基经由一个自由基机制反应。本发明另提供制备该组合物之方法，该组合物施用于基底表面之方法，及由其制备之装配(assemblies)用于连接微电子电路。092129283-p01.bmp

The present invention provides co-curable compositions in which an anionically or cationically reactive component, such as an epoxy or episulfide resin component; a free radical polymerizable component; and a cross linking component, where the cross linking component is reactive with each of the anionically or cationically reactive component and the free radical polymerizable component through functionalization with at least one group reactive through an anionic or cationic mechanism and at least one group reactive through a free radical mechanism. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.