本发明揭示一种具有第一打线接合区域(202)及第二打线接合区域(204)之接线垫(200)。在一项具体实施例中，该第一打线接合区域(202)延伸至一钝化层(18)上。在另一具体实施例中，一接线垫(300)具有一探针区域(302)、一第一打线接合区域(304)及一第二打线接合区域(306)。在一项具体实施例中，该探针区域(302)及该打线接合区域(304)延伸至一钝化层(18)上。该等接线垫可具有任何数目的打线接合及探针区域，且可为任何的组态。使该等接线垫具有多个打线接合区域的能力可允许多个打线连接到一个单一接线垫，例如在多芯片包装中。使该等接线垫可延伸到该钝化层之上的能力亦可允许降低集成电路晶粒区域。

A bond pad (200) has a first wire bond region (202) and a second wire bond region (204). In one embodiment, the first wire bond region (202) extends over a passivation layer (18). In an alternate embodiment, a bond pad (300) has a probe region (302), a first wire bond region (304), and a second wire bond region (306). In one embodiment, the probe region (302) and the wire bond region (304) extend over a passivation layer (18). The bond pads may have any number of wire bond and probe regions and in any configuration. The ability for the bond pads to have multiple wire bond regions allows for multiple wire connections to a single bond pad, such as in multi-chip packages. The ability for the bond pads to extend over the passivation layer also allows for reduced integrated circuit die area.