本发明之树脂填封成形设备,包含有:具有三模构造之模块品、及包覆分别对应两片基板之2个模穴离型薄膜。前述2个模穴分别具有由下模模穴面、模穴侧面及连接路面所构成之模穴面。又,该树脂填封成形设备分别沿着前述2个模穴的形状,在离型薄膜呈张力拉伸的状态下,分别包覆于前述2个模穴。此状态下,在前述2个模穴内注入熔融树脂,且前述熔融树脂通过使前述模穴互相连通之连通路,均等地分配于前述2个模穴。然后,令两片基板上的复数电子零件几乎同时浸渍于前述2个模穴内的熔融树脂并压缩成形。

A resin encapsulation molding apparatus comprises die assembly (50) of triple die structure and mold release film (15) for covering two cavities (26) respectively corresponding to two substrates (1). Each of the two cavities (26) comprises inferior die cavity face (29), cavity side face (30) and cavity face (32) consisting of communication channel face (31). The mold release film (15) in the state of being tensioned covers each of the two cavities (26) along the morphology thereof. In this condition, molten resin (5) is injected into the two cavities (26). The molten resin (5) is evenly distributed into the two cavities (26) through communication channel (27) communicating the two cavities (26) with each other. Thereafter, the multiple electronic parts on the two substrates (1) are almost simultaneously immersed in the molten resin (5) within the two cavities (26) and are compression molded.