本发明提供了一个小型、高性能之半导体组件,其防止相邻导线之间互相接触,以增加布线设计之弹性,并提供了用于制造半导体组件的一个有效率方法。半导体组件包括一块在其表面上配置了一个电极之基板;以及一个在其表面上配置了一个电极且由基板支撑的第一半导体构件,其中有一条第一导线透过第一凸块接至基板及半导体构件上方的至少其中一个电极(亦即电极21及22之中至少其中一个),并有一条第二导线透过第二凸块接至导线的一个接合部分。

To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.