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发明专利
TW200904924A 黏接著劑組成物、黏接著片及半導體裝置之製造方法 ADHESIVE COMPOSITION, ADHESIVE SHEET AND PRODUCTION PROCESS FOR SEMICONDUCTOR DEVICE 审中-公开
黏接着剂组成物、黏接着片及半导体设备之制造方法 ADHESIVE COMPOSITION, ADHESIVE SHEET AND PRODUCTION PROCESS FOR SEMICONDUCTOR DEVICE

黏接著劑組成物、黏接著片及半導體裝置之製造方法 ADHESIVE COMPOSITION, ADHESIVE SHEET AND PRODUCTION PROCESS FOR SEMICONDUCTOR DEVICE
摘要：
本發明是提供一種黏接著劑組成物,其係在組裝薄的半導體晶片之封裝中,即使曝露在嚴苛的回焊條件下,也不會發生接著界面之剝離或封裝破裂,可以達到高封裝可靠度的黏接著劑組成物。本發明之黏接著劑組成物之特徵,係含有丙烯酸聚合物(A)、環氧當量在180 g/eq以下之環氧樹脂(B)、及硬化劑(C)者。
摘要（中）：

本发明是提供一种黏接着剂组成物,其系在组装薄的半导体芯片之封装中,即使曝露在严苛的回焊条件下,也不会发生接着界面之剥离或封装破裂,可以达到高封装可靠度的黏接着剂组成物。本发明之黏接着剂组成物之特征,系含有丙烯酸聚合物(A)、环氧当量在180 g/eq以下之环氧树脂(B)、及硬化剂(C)者。

摘要（英）：

The adhesive composition according to the present invention is characterized by including an acrylic polymer, an epoxy resin having an epoxy equivalent of 180 g/eq or less and a thermosetting agent. According to the present invention, provided are an adhesive composition which can achieve a high package reliability in a package in which a semiconductor chip being reduced in a thickness is mounted even when exposed to severe reflow conditions, an adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet.

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