本案提出一种具有导孔之多芯片封装结构与方法，包含：至少具有两芯片之芯片组；其中，该些芯片系以堆栈方式结合于一起，且该些芯片中之任一者皆设置有复数个接合垫层；以及一基板，具有用以贯穿该基板板体之至少复数个导孔，且一导电材料充填并分布于该些导孔中；其中，位于任一导孔中之导电材料，于靠近该基板之一上板体表面以及一下板体表面处分别凸出形成一接合凸块，且位于该上板体表面处之该些接合凸块，系与该些芯片中之至少一者的该些接合垫层直接对应连接。

This invention is related to a packaging structure for multiple chips and a packaging method using in the same, including a chipset having at least two chips, wherein they are formed with a stacked type and any one thereof having a plurality of pads, and a base having at least a plurality of contact holes penetrated therethrough, wherein a conducted material is diffused and filled therewith. Especially, there exist corresponding solder balls respectively formed on the top/bottom of any contact hole and respectively near the top/bottom surface of the base. Therefore, any corresponding solder ball near the top surface of the base can be used to contact with a corresponding pad of at least one of the two chips.