本发明提供一种总成及其制作方法。该总成可包括:一第一组件,其包括具有一经曝露表面之一介电区;一导电垫,其在该表面处,由具有沿该表面以一振荡或螺旋路径延伸之至少一部分之一导电组件界定;及一导电结合材料,其接合至该导电垫并桥接毗邻段之间的该介电表面之一经曝露部分。该导电垫可准许该第一组件与具有透过该导电结合材料接合至该垫的一端子之一第二组件的电互连。该导电组件之该路径可或可不自身重叠或交叉。

An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.