描述一种组装组件及一种使用该组装组件以组装芯片封装之技术。此芯片封装包括一组配置于垂直方向之一堆栈中的半导体晶粒,其系于水平方向被彼此偏移以界定一步进阶地于垂直堆栈之一侧上。此外,芯片封装可使用组装组件来组装。特别地,组装组件可包括一具有另一步进阶地之壳体。此另一步进阶地可包括垂直方向上的步进之一串行,其被彼此偏移于水平方向。再者,壳体可被组态成匹配与该组半导体晶粒,以致该组半导体晶粒被配置于垂直方向之堆栈中。例如,另一步进阶地可几乎为该步进阶地之镜像。

An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terraced at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a housing having another stepped terrace. This other stepped terrace may include a sequence of steps in the vertical direction, which are offset from each other in the horizontal direction. Furthermore, the housing may be configured to mate with the set of semiconductor dies such that the set of semiconductor dies are arranged in the stack in the vertical direction. For example, the other stepped terrace may approximately be a mirror image of the stepped terrace.