关于实施型态之半导体设备系具备:基台、被实装在该基台上之半导体组件、设置跟基台疏离之电极端子、接续半导体组件跟电极端子之接续构件、与接合材。接续构件,系在跟半导体组件接续之一端部设置复数个贯通孔。此外,接合材系介在半导体组件、跟接续构件之间,而且,深入复数个贯通孔内。

According to one embodiment, a semiconductor device includes a base, a semiconductor element, an electrode terminal, a connecting member and a joining material. The semiconductor element is mounted on the base. The electrode terminal is provided spaced from the base. The connecting member connects the semiconductor element to the electrode terminal and includes a plurality of through holes provided in one end portion of the connecting member. The one end portion is connected to the semiconductor element. The joining material intervenes between the semiconductor element and the connecting member and penetrates into the plurality of through holes.