本发明揭示一种倒装芯片互连,其形成系将互连凸块直接啮合至一引在线,而非啮合至一捕获焊垫上。还有,一倒装芯片封装包括:一晶粒,其在一作用表面中具有黏在互连焊垫上的焊料凸块;及一基板,其在一晶粒黏着表面中具有导电接线,其中该等凸块系直接啮合在该等接在线。该互连的形成并未采用一焊料遮罩。还有,用于形成一引在线凸块之倒装芯片互连的方法也免除焊料遮罩的使用。在某些方法中,会将一可固化黏着剂涂在该晶粒的凸块上或该基板的接在线;该黏着剂可在该啮合进程期间部分固化,及该部分固化的黏着剂可在一回熔进程期间用来限制熔化的焊料。

A flip chip interconnect is made by mating the interconnect bump directly onto a lead, rather than onto a capture pad. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having electrically conductive traces in a die attach surface, in which the bumps are mated directly onto the traces. The interconnection is formed without employing a solder mask. Also, a method for making a bump-on-lead flip chip interconnect avoids the use of a solder mask. In some methods a curable adhesive is dispensed either onto the bumps on the die or onto the traces on the substrate; the adhesive is partly cured during the mating process, and the partly cured adhesive serves to confine the molten solder during a reflow process.