提供一种与用于电镀基板(诸如，半导体晶圆)之处理器一起使用之侦测夹具，以侦测该处理器的筒体中的电解液水平面。该侦测到的电解液水平面用于控制将基板引入到电解液中，以实现所期望的电解液润湿特性。该处理器具有基板固持器，该基板固持器支撑在一升降器上，该升降器用于使该基板固持器下降到筒体中。侦测夹具可仿真基板且被基板固持器以基板固持器固持基板之相同方式固持。该升降器使侦测夹具下降，直至该侦测夹具接触该电解液，其中夹具位置指示电解液水平面。随后自处理器移除侦测夹具。

A detection fixture is provided with a processor for electroplating a substrate such as a semiconductor wafer, to detect the level of electrolyte in a bowl of the processor. The detected electrolyte level is used in controlling entry of the substrate into the electrolyte, to achieve desired electrolyte wetting characteristics. The processor has a substrate holder supported on a lifter for lowering the substrate holder into the bowl. The detection fixture may emulate a substrate and be held by the substrate holder in the same way that the substrate holder holds a substrate. The lifter lowers the detection fixture until it makes contact with the electrolyte, with the position of the fixture indicative the electrolyte level. The detection fixture is then removed from the processor.