一种传导互链接构包含一接触垫，一导电体之一第一端与该接触垫相连，以及一导电层位于该导电体之一第二端。该导电体具有一纵向垂直于该接触垫之一表面。该导电体具有一位于横截面(面A)之平均粒径(a)，该横截面之法线垂直于该导电体之纵向。该导电层包含位于面A之一平均粒径(b)。该导电体及该导电层皆是由相同材料组成，且该平均粒径(a)大于该平均粒径(b)。

A conductive interconnect structure includes a contact pad; a conductive body connected to the contact pad at a first end; and a conductive layer positioned on a second end of the conductive body. The conductive body has a longitudinal direction perpendicular to a surface of the contact pad. The conductive body has an average grain size (a) on a cross sectional plane (Plane A) whose normal is perpendicular to the longitudinal direction of the conductive body. The conductive layer has an average grain size (b) on Plane A. The conductive body and the conductive layer are composed of same material, and the average grain size (a) is greater than the average grain size (b).