一种利用导通片桥接黏贴技术之芯片堆栈结构包含有一基板、一第一芯片、至少一桥接件、一导通片及一第二芯片，第一芯片电性连接于基板之第一电极，至少一桥接件系于两端具有一第一桥接面及一第二桥接面，第一、第二桥接面分别电性连接于第一芯片及基板之第二电极，导通片电性连接于至少一桥接件之第一桥接面，以及第二芯片堆栈且电性连接于导通片。借此，本创作之结构不仅利于芯片之堆栈，更具有提高耐电流及散热之功效。

A chip stack structure using conductive sheet bridge adhesion technology comprises a substrate, a first chip, at least one bridge element, a conductive sheet, and a second chip. The first chip is electrically connected to a first electrode of the substrate. The at least one bridge element has a first bridge surface and a second bridge surface at two ends, and the first bridge surface and the second bridge surface are electrically connected to the first chip and a second electrode of the substrate, respectively. The conductive sheet is electrically connected to the first bridge surface of the at least one bridge element. The second chip is stacked and electrically connected to the conductive sheet. Thus, the structure of the present invention not only facilitates the ease of stacking the chips but also increases the effectiveness of ability of withstanding electrical current and heat dissipation.