本发明揭示一种半导体设备及其之一制造方法。该半导体设备包含一半导体晶粒，诸如经安装于一基板之一表面上之一控制器晶粒。一间隔层亦经安装至该基板上，其中该半导体晶粒适配于经形成通过该间隔层之第一及第二主相对表面之一孔或一缺口内。可将诸如闪存晶粒之额外半导体晶粒安装于该间隔层之顶上。

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.