本发明揭示一种微电子总成10，其可包括一基板30，该基板具有第一表面34及第二表面58、在该第一表面与该第二表面之间延伸之一孔口39及端子36。该总成10亦可包括具有面对该第一表面34之一前表面16之一第一微电子组件12、具有突出超过该第一微电子组件之一边缘29之一前表面22之一第二微电子组件14、将该等微电子组件之触点20、52电连接至该等端子之第一引线70及第二引线76及将该第一微电子组件及该第二微电子组件之触点电互连之第三引线73。该第一微电子组件12之触点20可毗邻边缘29而安置。该第二微电子组件14之触点26可安置于其前表面22之一中心区19中。该等引线70、76、99可具有与孔口39对准之部分。

A microelectronic assembly 10 can include a substrate 30 having first and second surfaces 34, 58, an aperture 39 extending therebetween, and terminals 36. The assembly 10 can also include a first microelectronic element 12 having a front surface 16 facing the first surface 34, a second microelectronic element 14 having a front surface 22 projecting beyond an edge 29 of the first microelectronic element, first and second leads 70, 76 electrically connecting contacts 20, 52 of the microelectronic elements to the terminals, and third leads 73 electrically interconnecting the contacts of the first and second microelectronic elements. The contacts 20 of the first microelectronic element 12 can be disposed adjacent the edge 29. The contacts 26 of the second microelectronic element 14 can be disposed in a central region 19 of the front surface 22 thereof. The leads 70, 76, 99 can have portions aligned with the aperture 39.