一种封装载板的制作方法。提供一载体，其中载板具有一接合表面。形成一可剥离防焊层于载体的接合表面上，其中可剥离防焊层完全覆盖接合表面。提供一基材，其中基材具有彼此相对的一上表面与一下表面。形成一第一图案化防焊层于基材的下表面上，其中第一图案化防焊层暴露出部分下表面。压合载体与基材，其中可剥离防焊层直接接触第一图案化防焊层，且载体透过可剥离防焊层暂时性地黏合于第一图案化防焊层上。

A manufacturing method of package carrier is provided. A carrier having a connecting surface is provided. A releasable solder resist layer is formed on the connecting surface of the carrier, wherein the releasable solder resist layer completely covers the connecting surface. A substrate having an upper surface and a lower surface opposite to each other is provided. A first patterned solder resist layer is formed on the lower surfaces of the substrate, wherein the first patterned solder resist layer exposes a portion of the lower surface. The carrier and the substrate are laminated, wherein the releasable solder resist layer directly connects to the first patterned solder resist layer, and the carrier is temporarily bonding to the first patterned solder resist layer by the releasable solder resist layer.