本发明系提供一种接合体之制造方法，其系借由比较低温之加热使第一被接合体与第二被接合体接合，而可获得接合后具有优异之耐热性的接合体。 本发明系关于一种接合体之制造方法，其中，玻璃膏系包含(A)结晶化玻璃料及(B)溶剂，(A)结晶化玻璃料具有玻璃转移温度、结晶化温度与再熔融温度，再熔融温度为超过结晶化温度之温度，结晶化温度为超过玻璃转移温度之温度，且该接合体之制造方法包含下列步骤：于第一被接合体与第二被接合体涂布玻璃膏之步骤；隔着玻璃膏使第一被接合体与第二被接合体接合之步骤；将隔着玻璃膏而接合之第一被接合体与第二被接合体加热至(A)结晶化玻璃料之结晶化温度以上、未达再熔融温度之步骤；以及将隔着玻璃膏而接合之第一被接合体与第二被接合体冷却至结晶化玻璃料之玻璃转移温度以下而制得接合体之步骤。

The present invention provides a method for manufacturing a bonded body that a first adherend is joined to a second adherend by heating at relatively low temperature to obtain a bonded body excellent in heat resistance after bonding. The present invention relates to a method for manufacturing a bonded body, wherein a glass paste comprises a (A) crystallized glass frit and a (B) solvent. The (A) crystallized glass frit has a glass transition temperature, a crystallization temperature and a remelting temperature, wherein the remelting temperature is a temperature a temperature exceeding the crystallization temperature, and the crystallization temperature is a temperature exceeding the glass transition temperature. The method for manufacturing bonded body comprises following steps: a step of applying the glass paste to the first adherend and the second adherend; a step of bonding the first adherend and the second adherend by interposing the glass paste; a step of heating the first adherend and the second adherend bonded by interposing the glass paste to the crystallization temperature or more and less than the remelting temperature of (A) crystallized glass frit; and a step of cooling the first adherend and the second adherend bonded by interposing the glass paste to the glass transition temperature or less to obtain a bonded body.