本发明系提供不致发生桥接、能增加焊接转印量的焊料转印片。焊料转印片1A系包括：基材5、在基材5之表面上形成的黏着层4、在黏着层4之表面上形成的含焊料粉末黏着层3、以及在含焊料粉末黏着层3之表面上形成的焊料粉末层2；焊料粉末层2系由焊料粉末20呈1层面状排列；含焊料粉末黏着层3系由焊料粉末30与黏着剂成分31混合，且焊料粉末30具有复数层重叠的厚度。

To provide a solder transfer sheet capable of increasing the solder transfer amount, without causing a bridge. A solder transfer sheet 1A includes a substrate 5, an adhesive layer 4 formed on the surface of the substrate 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, solder powder 20 is arranged like a plane of one layer, and in the solder powder-containing adhesive layer 3, solder powder 30 and a pressure-sensitive adhesive component 31 are mixed, and the solder powder 30 has a thickness overlapping a plurality of layers.