一种用于电子组装制程的组成，组成包含分散于有机介质的填料，其中：有机介质包含聚合物；填料包含一或更多的石墨烯、官能化石墨烯、氧化石墨烯、多面体寡聚半硅氧烷、石墨、二维材料、氧化铝、氧化锌、氮化铝、氮化硼、银、奈米纤维、碳纤维、钻石、奈米碳管、二氧化硅和金属涂覆粒子，及组成按组成总重量计包含0.001-40重量%的填料。

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.