一种对金属材料进行蚀刻时能够防止端子脱离，且无需高价之进程，能够底价制造的半导体组件安装用引线框架、半导体设备及其制造方法。半导体组件安装用引线框架包括金属板(10)、设于该金属板的表面(11)上的半导体组件安装区域(13)、形成于金属板的表面上的半导体组件安装区域周围的内部端子用镀层(20)及(21)、形成于金属板背面上与内部端子用镀层为相反侧的位置的外部端子用镀层(30)，内部端子用镀层具有树脂脱离防止结构，用于防止金属板的表面被密封树脂(80)覆盖时从该密封树脂脱离，而外部端子用镀层不具有该树脂脱离防止结构。

A semiconductor lead frame includes a metal plate and a semiconductor chip mounting area provided on a top surface of the metal plate. A first plating layer for an internal terminal is provided around the semiconductor chip mounting area. A second plating layer for an external terminal is provided on a back surface of the metal plate at a location opposite to the semiconductor chip mounting area. The first plating layer includes a fall-off prevention structure for preventing the first plating layer from falling off from an encapsulating resin when the top surface of the metal plate is encapsulated in the encapsulating resin. The second plating layer does not include the fall-off prevention structure.