一种晶圆级封装结构的制造方法，包括：配置一芯片至一载板上，其中芯片包括相对的一主动面、一背面及位于主动面的多个芯片接垫，芯片的背面透过一薄膜型黏晶层固定至载板。配置一包封体于载板上以对芯片进行一露晶封胶进程，其中包封体环绕芯片且芯片的这些芯片接垫外露于包封体。形成一重配置线路层于芯片的主动面上，其中重配置线路层电性连接于这些芯片接垫。将载板与薄膜型黏晶层分离于芯片。

A manufacturing method of wafer level package includes the following steps. Dispose a chip onto a supporting board, wherein the chip includes an active surface, a back surface opposite to each other and a plurality of pads on the active surface, and the back surface is fixed to the supporting board through a DAF. Dispose a molding on the supporting board to proceed a wafer level exposed die molding procedure, wherein the molding surrounds the chip and the pads are exposed out of the molding. Form a RDL on the active surface, wherein the RDL is electrically connected to the pads. Remove the support board and the DAF from the chip.